How to choose various types of Mechanical Seals
How to choose various types of Mechanical Seal s 1 Epoxy modified one-component product 1 Density varies from 1.1 to 2.8, curing time is 50 degrees/4 hours or 110 degrees/30 minutes or 110 degrees/50 minutes; 2 With moderate thixotropy, the electronic components can be covered and wrapped by covering on the circuit board, and the glue can be leveled by itself, but it does not flow, nor does it flow during the baking and curing process, maintaining the original shape; 3 The cured material is black or amber bright, has strong adhesion to circuit boards and electronic components, and can withstand high temperature of 200-300 ℃ and strong acid desulfurization pump mechanical seal alkali corrosion and corrosion resistance of various solvents; 4 Higher bonding strength, better heat resistance, bonding force can reach device damage, temperature resistance can also reach device damage, the cured product is not corroded by professional solvents, and the circuit and electronic components can be...